용도 분류

• Back Grinding
• Dicing
• Thermal Resistance
• Functional

특성 분류

• Low contamination
• Bump absorption
• High adhesion
• High accuracy
• Anti ESD
• Chemical resistance
• Thermal resistance
• Expandability
• Transparent
• Self release
• Minimizes wafer breakage

세부 자료 : 일본어 / English